ISF 2017, 22 to 24 February 2017 - Metal Finishers Association of India, VISIT US AT STALL NO.  J-5, Hall No. 12, Pragati Maidan, New Delhi

Copper Salts

Cuplate Copper Salt

Application

A cyanide copper plating process to produce uniform semi-bright copper deposits. It is used as an undercoat prior to Nickel, as a strike to acid copper plating, etc. Suitable for both Vat and Barrel plating.

Operating Conditions
  • Conc. 80 - 140 gms./Lt
  • Temperature 50o - 55o C
  • Current Density 1 - 1.5 A/dm2

 

Cuplate Rochelle Copper Salt

Application

A cyanide based copper plating process most suitable to electroplate heavy copper deposits on Zinc based die castings. Gives smoother and brighter deposits without attacking the base metal.

Operating Conditions
  • Conc. 100 - 150 gms./Lt
  • Temperature 50o - 55o C
  • Current Density 1 - 3 A/dm2

 

Cuplate D

Application

To give matt copper deposits.

CUPRASOL

Application

CUPRASOL is an internationally acclaimed modern HIGH SPEED HEAVY BUILD ALKALINE COPPER PLATING SYSTEM. A step forward towards 'NEW GREEN LEAF TECHNOLOGY" programme of PCI.